ESC is the part to fix the wafer in semiconductor manufacturing equipment by the power of static electricity. Generally ESC is classified into monopolar type and bipolar type according to the number of electrodes. And it also divied into COLUMB type and JONSEN-RAHBEK type depending on the the size of Dielectric Resistivity.

 

 

 

 

 

 

Process that removed selectively unnecessary parts using chemical method or corrosive gas to make semicondutor circuit pattern on the wafer.

 

ETCH TYPE : DRY ETCH / WET ETCH


WET ETCH

Material is selectively etched and removed by using various reactive chemical solution.


DRY ETCH

Material is selectively etched and removed by using reactive gas or using electrically decomposed gas.


 

 

CVD is the process that forming conductive flim or insulation flim on the surface of wafer by deposited particles made ​​of a suitable active and reactive energy injected reactive gas

 

TYPE OF CVD : Representative types of CVD are LPCVD(Low Pressure CVD) and PECVD(Plasma Enhanced CVD)


PE-CVD

PE-CVD is the process that forming thin flim after making react actively by producing SiH4 helping deposited in the chamber.


LP-CVD

LP-CVD is the process of forming a thin flim deposited in a vacuum.


 

Process for selectively injecting Dopant  charged by high-energy to the surface of the wafer. And Injecting a quantity of correct-ion in the correct position and depth.

 

 

 

 

Inspecting about Product’s Condition & function

 

 

 

 

 

(If necessary) Re-bonding Ceramic plate with BASE

 

 

 

 

 

Patterning on the Surface of Ceramic Plate 

 

Before Shipping, Final inspecting of surface, function & He leak

 

 

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Comparison before & after


Repaired Product

applied ESC REPAIR

pursue having life time and function same as A class to recover Flatness, bonding layer, Embossing and electric fucntion.

 

Spec

• Flatness spec : max 20um

• Roughness spec : max 0.3um

• Embossing height spec : 10±3um

 

 

 

 Before Repair

 

 

 

Fail mode

• Side embossing etching : 4um

• Roughness : max 0.4um

• Flatness NG : 25um

• Embossing & Rib damage

 

 

 After Repair

 

 

 

Repair mode

• Embossing height : 10um

• Roughness : 0.1um

• Flatness : 5um

• Recovering similar to original(NEW) product by repair processing damaged bonding layer of heater due to plasma